Mar. 1985, Registration and establishment at Hong Kong;

Aug. 1986, Established factory in Shen zhen, Guangdong Province, P. R. China, Manufacture traditional Sn-Pb solder products;

May. 1988, Development of series of flux products;

Mar. 1990, Development of solder ball. electroplating anodes, alloy wire, etc;

Jul. 1992, Development of Ni-plated solder wire, special solder wire for soldering stainless steel, application field was continually enlarged;

Jan. 1995, Development of high and low-temperature solder products;

Aug. 1997, Products with 'YIKST' brand began to enter into overseas market;

May. 1998, Concept of environmental protection was inspired, development of no-clean and water soluble solder products;

Jan. 2000, Enter into the field of surface mount technology, development of solder paste;

Jan. 2000, Approved ISO 9001 international certification;

Sep. 2001,Established Soldering and Microjoining R&D Center.

Mar. 2002, Development of lead-free solder products;

Sep. 2002, Establishment of 'Work station for doctor candidate of Harbin Institute of Technology' in our R&D Center;

Jan. 2003, New office building came into use;

Jan. 2003, Applied for patents of lead-free solder;

Aug. 2003, Development of low-VOC flux;

Aug. 2003, Became one of the main members to draft the China lead-free solder standard.

Jan. 2004，A new factory of 30000 m2 area in Dongguan came into use。