Solder ball for electroplating

High purity alloy is used and the impurity level is strictly limited. During manufacturing, every process is under precise controlling. The alloy oxide is reduced to the possible lowest extent and the non-ferrous contamination is completely removed.

Solder ball for packaging

This product has excellent purity and sphericity, it is suitable for modern packaging, e.g., BGA and CSP, and microjoining. In application, solder ball can self-adjust within a relative larger placing error, the problem of end flatness can be out of consideration.