Yik Shing Tat Solder Manufacturer Co , ltd had been registered in Hong Kong at March 1985.the 21st century, compliant to the tendency of GREEN and Environmental Protection ,YIKST is pursuing a new developing process
Sep. 2001, “Soldering and Micro joining R&D Center” was established. “Work station for doctoral candidates of Harbin Institute of Technology” was set up at the same time
Mar.2002 Development of series of LEAD-FREE solder products
Aug. 2003, Development of Water-based, Low-VOC flux
Aug. 2003, Approved as one of the main members to draft the China National Standard on “Lead-Free Solders” (GB/T 20422-2006) by Standardization Administration of China
Apr.2004, Authorized “Sublicense Agreement” for the US patent on “Sn-Ag-Cu lead-free solder” (US Patent No.5527628)
Apr.2004.New factory with 30000m land area, locating at Qi Shi Town, Dong Guan, came into use
Jan.2005, Approved ISO 9001 and ISO 14001 international certifications (SGS)
Feb.2005, Development of “Lead-free solder with BEST Performance/Price Ratio—M507 Alloy”
May 2005, Development of environmental-friendly cleaning agent: ECO CLEANER
June 2005, “Sn-Ag-Cu lead-free solder with high anti-oxidation property” was authorized the invention patent by State Invention patent by State Intellectual Property Office of P.R.C(China Patent No. ZL 03 1 10895.4)
Nov.2005, Su Zhou Company had been established
Feb.2006,”Lead-free solder alloy for wave soldering” was authorized the invention patent by State intellectual property office of P.R.C (China patent no zl o31 11446.6)
July 2007, cross-licensing of patents with American Indium Co. on Pb-free solders with low Ag content so that the validity of intellectual property for the corresponding Pb-free solders had been further ensured.
Aug. 2007, M0507 Pb-free solder wire product had been approved by SONY. Further, we had been approved as SONY OEM GREEN PARTNER since Feb. 2008.
Dec. 2007, Approved IECQ HSFM QC080000 international certification (SGS)
2008，As the main member to draft three China National Standards: “Test method of the strength for brazed and soldered joint”(GB/T 11363-2008), “Test method of wettability for brazing filler metals”(GB/T 11364-2008) and “Soft soldering flux – Classification and requirements” (GB/T 15829-2008)
2009, R&D center is taking on two research projects funded by Guang Dong Science and Technology Department, our company received the Standardization Stratagem Fund from Shen Zhen Government
Apr. 2010, Approved the new version of ISO 9001:2008 international certification (SGS)
May 2010, Tian Jin company and Kun Shan office had been established