Yik Shing Tat Solder Manufacturer had been registered in Hong Kong at March 1985. in 21st century,compliant  to the tendency of GREEN and Environmental Protection,YIKST is pursuing a new developing process.     

Jan.2000,Approved ISO 9001 international certication(DNV).

Sep.2001,"Soldering and Microjoining R&D Center" was established."Wrok station for doctoral candidates of Harbin lnstitute of Technology"was set up at the same time.

Mar.2002,Development of series of LEAD-FREE solder products.

Jan.2003,New office building locating at Bao an District,Shen Zhen,came into use.

Aug,2003,Development of  Water-based,Low-VOC flux.

Aug.2003,Approved as one of the main members to draft the China National Standard on "Lead-Free Solders"(GB/T20422-2006)by Standardization Administration of China.

Apr.2004,Authorized"Sublicense Agreement"for the US patent on "Sn-Ag-Cu Lead-Free solder"(US Patent No.5527628) .

Apr.2004,New factory with 30000㎡ land area,locating at Qi Shi Town,Dong Guan,came into use.

Jan.2005,Approved ISO 9001 and ISO 14001 international certifications(SGS).

Feb.2005,Development of "Lead-Free solder with BEST Performance/Price Ratio---M507 Alloy".

May.2005,Development of Development of environmental-friendl cleaning agent:ECO CLEANER .

June.2005,"Sn-Ag-Cu Lead-Free solder with high-oxidation property" was authorized the invention patent by state intellectual Property Office of P.R.C(China Patent No.ZL 03 110895.4) .

Nov.2005,Su Zhou Company had been established.

Feb.2006,"Lead-Free solder alloy for wave soldering"was authorized the invention patent by State intellectual Property Office of P.R.C(China Patent No.ZL 03 11 1446.6).

March 2007, introduced halogen-free solder series .

December2007，Approved QC080000 international certifications.

July 2007, cross-licensing of patents with American Indium Co. on Pb-free solders with low Ag content so that the validity of intellectual property for the corresponding Pb-free solders had been further ensured.

Aug. 2007, M0507 Pb-free solder wire product had been approved by SONY. Further, we had been approved as SONY OEM GREEN PARTNER since Feb. 2008.

Dec. 2007, Approved IECQ HSFM QC080000 international certification (SGS).

2008，As the main member to draft three China National Standards: “Test method of the strength for brazed and soldered joint”(GB/T 11363-2008), “Test method of wettability for brazing filler metals”(GB/T 11364-2008) and “Soft soldering flux – Classification and requirements” (GB/T 15829-2008).

2009, R&D center is taking on two research projects funded by Guang Dong Science and Technology Department, our company received the Standardization Stratagem Fund from Shen Zhen Government.